I will design hdi pcb layout with micro via and multi layer routing

HDI PCB DESIGN WITH MICRO-VIA & ULTRA-DENSE MULTI-LAYER ROUTING

hdi pcb design  |  micro via  |  multi layer pcb  |  compact pcb  |  kicad layout

Need to fit a complex circuit into a wearable, a miniaturized medical device, or a compact IoT module? Standard through-hole vias eat too much space. You need HDI and you need someone who knows how to use it correctly.

HDI CAPABILITIES

Micro-via design (laser drill, 0.1mm diameter) IPC-2226 compliant

Blind via (L1 to L2, L(n-1) to Ln) any-layer HDI on request

Buried via internal layers only, minimizing layer transitions

Via-in-pad with resin fill ideal for BGA fan-out on 0.4mm pitch CSPs

Sequential lamination build-up (1+N+1, 2+N+2 structures)

BGA fan-out routing 0.4mm, 0.5mm, 0.8mm pitch devices

Fine-pitch QFN and flip-chip component placement

Impedance control on inner layers stripline, embedded microstrip

DFM checks for HDI-capable fabricators (Würth, PCBWay, Eurocircuits, JLCPCB premium)

DELIVERABLES

Altium Designer or KiCad project files (your choice)

Fabrication-ready Gerbers with correct drill files per lamination sequence