
Harry
Automotive and High Speed PCB Design Engineer
Compétences

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Expérience professionnelle
Hardware & PCB Design Engineer
LinkedIn • Temps plein
Jun 2022 - Present • 4 yrs 2 mos
Architected and deployed high-reliability multilayer PCB layouts for automotive systems, IoT hardware, and power electronics. Key Achievements & Scope: • Engineered 4-to-12 layer controlled-impedance boards featuring CAN FD, SPI, and USB high-speed communication interfaces. • Applied strict automotive EMC/EMI mitigation strategies and AEC-Q200 component qualification to achieve a 100% first-pass factory fabrication success rate. • Validated signal integrity (SI) and power integrity (PI) through 3D field solver simulations using Altium Designer and Ansys SIwave. • Optimized manufacturing workflows by generating complete IPC-compliant Gerber RS-274X/X2, BOM, Pick & Place, and assembly drawing packages.