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Wendi K
@packagingeng_id
Level 1
Industrial Packaging Structural Engineer, ArtiosCAD Dieline Specialist
Indonésie
Anglais, Indonésien
À propos de moi
Structural Packaging Engineer with 12+ years at two global leaders: Asia
Pulp & Paper (APP) and Tri-Wall (Japan).
I create precise, manufacturing-ready dielines using ArtiosCAD. Whether
standard RSC boxes, complex mailers, or heavy-duty industrial packaging,
I engineer solutions ready for immediate production.
Deep expertise: Material properties (E-flute, B-flute, Triple Wall),
structural integrity, cost optimization, and international compliance
(FEFCO/ECMA).
Your packaging isn't just design—it's engineered for factory success. Fast turnaround.
Message me your specifications.
Compétences
Wendi K
hors ligne •
Temps de réponse moyen de 5 heures
Voir mes services
Conception de découpe
I will create professional artioscad dielines and 3d packaging
4 Avis
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Détails de la notation
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1 à 4 avis sur 4
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Les plus pertinents
kimscopelliti
États-Unis
Wendi really understood what I was looking for in packaging and went the extra mile to deliver a very professional design that met my goals. I look forward to working with him again in the near future. Thank you, Wendi!
Utile?
shivismagee
Royaume-Uni
Réponse du freelance
Utile?
mofado77
Client récurrent
Canada
Utile?
anasumardi
Indonésie
Perfect dieline for products with minimal height. Efficient and cost-effective.
Utile?
