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Talha Alam
@talha010alam
Expertise in AI Hardware Acceerator, ASIC, FPGA, RISC V, Embedded system
Pakistan
Anglais
À propos de moi
About Me
Hi! I am a Electronics Engineer specializing in AI hardware acceleration, FPGA design, RISC-V, and embedded systems. My expertise includes custom instruction set development, accelerator integration (Gemmini, Chipyard), and FPGA prototyping for efficient computing solutions. I have strong skills in Verilog/SystemVerilog, RTL design, and microcontroller-based embedded applications, with published international research in IoT and smart systems. I deliver SoC design, FPGAbased AI accelerators, embedded solutions, and end-to-end prototyping tailored to your project
Compétences
Talha Alam
hors ligne •
Temps de réponse moyen de 1 heure
Voir mes services
Systèmes intégrés & IoT
I will design fpga systems in verilog vhdl and systemverilog
Systèmes intégrés & IoT
I will design ai hardware accelerators for fpga and asic
Portfolio
Expérience professionnelle
Lead ASIC Design Engineer & Chip Architect
LightRail AI
Jul 2026 - Present • 3 mos
As Lead ASIC Design Engineer & Chip Architect, I led the end-to-end development of a multi-precision Neural Compute Accelerator, taking the design from architecture and RTL through physical implementation and final chip-level GDSII. I defined and integrated the accelerator architecture around INT8, BF16, BF24, and FP32 accumulation, using shared compute resources, SIMD processing, systolic/tiled GEMM execution, convolution support, tensor/register storage, and an AXI4-Lite control interface. My responsibilities included RTL architecture, datapath design, verification, synthesis, timing analysis, floorplanning, placement, routing, hierarchical hard-macro integration, IO padframe construction, power distribution, chip-level routing, density fill, and final GDSII assembly using the SkyWater SKY130 130 nm process. The final chip implementation includes an 8.2 mm × 8.2 mm die, a 6.525 mm × 6.525 mm hardened accelerator core, 154 signal GPIO pads, 16 power/ground pads, and a complete IO ring. The routed design contains approximately 1.044 m of interconnect and 5,999 vias, with zero detailed-routing violations in the completed OpenROAD routing stage. This role involved both chip architecture and physical-design leadership, requiring decisions across compute architecture, mixed-precision arithmetic, timing closure, hierarchical integration, IO planning, PDN design, and fabrication-oriented GDSII handoff.
